Thermal Analysis of 6U VPX Plug-in unit

Case Study

A Fortune 500 company in defense sector

Case Study Image

Project Scope

  • Non-linear transient thermal analysis at PCB level.
  • Design and thermal analysis of thermal pad for 6U VPX PCBs (CPU, I/O, Backplane, and Front Panel/Connector).
  • Design and thermal analysis of outer chassis consisting of PCB and thermal pad.

Project Deliverables

  • Thermal gradient, heat flow rate and temperature contour plots are recorded at the PCB level, thermal pad and outer surface of the chassis with variation in time.

Key Tools

  • Hypermesh
  • Analysis on LS-DYNA

About Us

SARACA is a rapidly growing product engineering services company with deep expertise in digital, artificial intelligence, and emerging new technologies. Founded in 2014, SARACA is powered by Gen Z and Millennials with greater focus on agility, customer centricity, faster technology adoption, and adherence to cultural sensitivity. Our digital natives perform their actions with speed and ensure that we exceed customer expectation every single time. SARACA adopted vertically integrated approach to build depth in the industries we operate in. Over the years we have built strong expertise in aerospace, defense, space, automotive, medical devices, Industrial, Farm Equipment, rail transportation, technology, semiconductor, and many other industries.

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Industries

Life SciencesAerospace and DefenseAutomotiveSemiconductorsIndustrialRail TransportationConsumer

Services

DigitalMechanicalEmbeddedAutomotive SolutionsSoftwareSystemManufacturingIETM
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